As electronic geometries decrease below 100 nm and signal frequencies increase above 10 GHz unintended cross-talk between component conductors becomes harder to prevent.  In addition, design signal voltage waveforms can experience delay or exhibit unexpected noise during implementation that can increase the likelihood that a system will fail to meet performance specifications. Traditional circuit analysis techniques, based on modeling devices as ideal voltage/current sources driving isolated resistive and capacitive loads, no longer suffice. For example, electrical properties of current conducting metal layers can cause voltage distortion in a signal due to conductor parasitic effects as compared to an ideal model voltage waveform.  Such a case is shown in the figure below where two distorted waveforms (based on two different material scenarios) cross a switching threshold trigger voltage at different times.  This trigger event radically changes the device’s performance from the simple ideal model and can cause the electronic system to fail.  The USC / Intel® SI program will consider such effects, how to measure them, and how to correct the outcome.

Program Objectives:

·        Train students to analyze and design the next generation of high-speed electronic circuits.

·        Establish a first-in-the-country Masters Level Signal Integrity Degree program*.

·        Provide graduates for Intel / industry trained in a high demand field for the USA and worldwide (Coop/intern appointments available).

·        Enhance the teaching & research cooperation between USC Electrical Engineering and key corporations (such as Intel®) involved with high speed products.

  *Even though SI is critical in the analysis and design of high speed circuits, there is no comparable program in any US university.

 Opportunity:

·        Improve USC’s world wide image in the engineering community.

·        Increase the ability of USC to attract a wide range of research funding.

·        Supply pipeline of SI graduates.

·        Leverage Intel’s presence in Columbia for support of  program.

The Need: 

·        There is a national & international shortage of SI engineers.

·        Experienced SI engineers are not available; we must grow them.

·        SI engineers need practical experience as well as a strong academic background.

Program Features:

·        Courses team-taught - USC and Intel

·        Material from Intel Bus Design Boot Camp

·        Latest design methods that really work

·        Content updates by industry keep the course “fresh”

·        Distance learning via Web & TV

·        Graduate student Lab experience

·        Graduate curriculum planned for signal integrity applications

Potential Contributors:

·        Measurement and Test equipment.

·        Software Vendors.

·        Federal Research and Education programs.

Curriculum Options:

·        Electromagnetic theory (ELCT 761),

·        High Speed Digital Systems (ELCT 573),

·        Microwave engineering (ELCT 561),

·        Mathematical methods (PHYS 515/6),

·        Computational Electromagnetics (ELCT 863),

·        Superconducting devices (ELCT 873),

·        Advanced Solid State Physics (PHYS 725),

·        Molecular Electronics (ELCT 891E),

·        Signal Integrity for High Speed Circuits (ELCT 762),

·        Signal Integrity on System Bus technology (ELCT 865), and

·        Dissertation credit (ELCT 899, PHYS 899), or

·        Thesis credit (ELCT 799 or PHYS 799).

“Rapid economic growth can be enhanced by relationships between the private sector and institutions of higher education.”

Remarks by Andrew A. Sorensen to USC’s Black Faculty and Staff Association, April 10, 2003.