System-in-package (SiP) technology is gaining importance in the semiconductor packaging industry because of its potential to address the design and test challenges of the earlier system-on-chip (SoC) technology. With its higher flexibility compared to SoC, SiP can combine multiple semiconductor technologies and allow designers to overcome integration difficulties without compromising on individual chip technologies. SiP has the ability to stack die vertically in three-dimension or horizontally side-by-side. Moreover, SiP offers flexible integration of different types of devices such as MEMS, bio-electronics, optoelectronics, power electronics, passive and active components, and antennas. The technology is facing tremendous challenges in system integrated co-design, electromagnetic modeling, optimization design methodologies, and low cost in high volume manufacturing. In this talk, the present status of the SiP technology will be reviewed, from its manufacturing process, material properties to RF and microwave performance of typical modules. Meanwhile, results for our projects based on SiP will be presented. The projects include designs of RF passive components, LTCC radio-over-fiber transceivers for WLAN extension, and millimeter wave front-ends for Gb/s data transmission. In the end, future research in SiP will be addressed.

Biography

Dr Yong-Xin Guo received his Ph.D. degree from City University of Hong Kong in 2001. Since September 2001, he has been with the Institute for Infocomm Research, Singapore, now as a Research Scientist. He also holds an appointment of Guest Professor of Nanjing University of Science and Technology (China). Dr Guo has published 60+ international journal articles and 70+ papers in international conferences. He holds one US patent and one China Patent. He is a TPC Chair of IEEE International Workshop on Radio-Frequency Integration Technology 2009, and Workshops/Tutorials Chair of Asia-Pacific Microwave Conference 2009. He was an organizer and chair of workshop on radio-over-fiber technologies in 2008 IEEE Radio and Wireless Symposium, and TPC members and session chairs for several international conferences. He is a senior member of IEEE. His current research interests include RF and microwave circuits, LTCC/LCP passives and modules, microstrip antennas, and radio-over-fiber technologies for broadband communications.